Sn99 No Clean Lead Free Solder Wire, 0.032", 113G (0.25 lbs)

Sn99 No Clean Lead Free Solder Wire, 0.032", 113G (0.25 lbs)4901 Sn99 No Clean Solder Wire is a solder wire for electronics. It uses a high purity eutectic Sn99. 3 Cu0. 7 alloy, complemented by a no clean, synthetically refined, spatter proof resin flux core. 4901 solder meets J STD 004B, ASTM B 32, and exceeds J STD 006C specifications. 4901 lead free solder achieves a consistent solder and flux percentage thanks to our state of the art extrusion wire drawing machine, which continuously monitors the wire to

4901 Sn99 No-Clean Solder Wire is a solder wire for electronics. It uses a high-purity eutectic Sn99.3/Cu0.7 alloy, complemented by a no-clean, synthetically refined, spatter-proof resin flux core. 4901 solder meets J-STD-004B, ASTM B 32, and exceeds J-STD-006C specifications. 

4901 lead-free solder achieves a consistent solder and flux percentage thanks to our state-of-the-art extrusion wire-drawing machine, which continuously monitors the wire to prevent voids and ensure consistency, providing a top-grade solder wire.

Features:

• Eutectic alloy (liquidus = solidus temperature)
• Alloy exceeds J-STD-006C and meets ASTM B 32 purity requirements
• Flux meets J-STD-004B
• Resin spreads like rosin-activated flux
• Virtually non-spattering
• Non-corrosive
• Non-conductive
• Halide-free
• Suitable for Use in Food Facilities as a Non-Food Chemical

Specifications:

• Type: Wire Solder
  
• Composition: Sn99.3Cu0.7 (99.3/0.7)
• Diameter: 0.032" (0.81mm)
  
• Melting Point: 442°F (227°C)
  
• Flux Type: No-Clean
  
• Wire Gauge: 20 AWG, 21 SWG
  
• Process: Lead Free
  
• Form: Spool, 4 oz (113.40g)
  
• Shelf Life: 60 Months
  
• Storage/Refrigeration Temperature: 50°F ~ 86°F (10°C ~ 30°C)

Datasheet

MSDS