BGA48 BGA63 2 in 1 Read Write Burn In Socket For XGecu T48 Programmer

BGA48 BGA63 2 in 1 Read Write Burn In Socket For XGecu T48 Programmer2 in 1 Programming Socket BGA48 BGA63 For XGecu T48 Programmer Supports all core operations of the XGecu T48 programmer, including chip erasure, program writing, data verification, and read back. The Adapter integrates compatibility for both BGA48 and BGA63 packaged chips. No additional adapters or driver adjustments are required for direct connection. Feature: Model: BGA63 BGA48 Brand: XGecu Package: BGA63 Interface: BGA63 Size: 10x6x5cm Supported

2-in-1 Programming Socket BGA48/BGA63 For XGecu T48 Programmer Supports all core operations of the XGecu T48 programmer, including chip erasure, program writing, data verification, and read-back. The Adapter integrates compatibility for both BGA48 and BGA63 packaged chips. No additional adapters or driver adjustments are required for direct connection.

Feature:
Model: BGA63 BGA48
Brand: XGecu
Package: BGA63
Interface: BGA63
Size: 10x6x5cm
Supported MCUs: MCU/Memory, etc.
Applications: Electronic Development/Appliance Repair

Specification:
1. Exclusively designed for the XGecu T48 programmer, with a physical interface and communication protocol fully compatible with the T48. No additional adapters or driver adjustments are required for direct connection.
2. 2-in-1 Package Support: Covers two mainstream BGA packages simultaneously:
BGA48: Suitable for small-size chips with 48 ball grid array pins (common in low-power MCUs and compact storage chips).
BGA63: Compatible with 63-pin BGA chips (often used in mid-range MCUs, FPGAs, and multi-functional integrated circuits).
Switching Method: Typically uses a replaceable positioning frame or adjustable buckle structure. Users only need to replace the corresponding frame (marked BGA48/BGA63) to switch between packages, with no need to disassemble the entire socket.
3. Supports all core operations of the XGecu T48 programmer, including chip erasure, program writing, data verification, and read-back (ensures consistency between written and target data).
4. Adopts high-precision Pogo Pins (spring-loaded probes) as contact terminals, with a contact resistance of less than 50mΩ to avoid signal loss.
5. The positioning frame has a tolerance of ±0.02mm, ensuring accurate alignment of chip solder balls with Pogo Pins (prevents poor contact caused by offset).
6. Wide Chip Compatibility: Works with multiple chip types under BGA48/BGA63 packages, such as:
Microcontrollers (MCUs): STM32 series, Nordic nRF series.
Memory chips: NOR Flash, NAND Flash, EEPROM.
Specialized chips: Bluetooth modules, sensor integrated circuits.